[Monocrystalline silicon]　Introducing our processing Machinery used in each steps of silicon manufacturing.：Silicon Processing Equipment

HOME > Silicon Processing Equipment：Introducing our processing Machinery used in each steps of silicon manufacturing. [Monocrystalline silicon]

In monocrystalline silicon, atoms are aligned in rule so that they can demonstrate their maximum ability.

Generation of metal silica

Quarry the silica from the mountains, and then restore it to a silicon metal with carbon.

Polycrystalline silicon deposition

Produce Trichlorosilane from silicon metal, and increase the purity of Trichlorosilane through a distilling and purifying process. After high temperature reduction with hydrogen, deposit high-purity polycrystalline silicon (polysilicon).

Monocrystalline silicon generation

Melt polysilicon in a furnace, pull it out to recrystallize, and generate monocrystalline silicon.

Monocrystalline silicon wafer manufacturing

1. Processing to the shape of a cylinder

After being pulled out from the furnace, monocrystalline silicon is cut to a certain length cylinder.

Bandsaw

Specify the exact length of monocrystalline silicon, and start cutting. Top, tail, sample, and product part of monocrystalline silicon are sorted and processed automatically.

2. Processing to the shape of a quadrangular prism

Cut 4 sides of longitudial to make a quadrangular prism leaving the R-surface.

2 flute 2 axis processing machine (flexible-blade)

Processing monocrystalline silicon to a quadrangular prism.
By using a work-stocker, the machine runs 24 hours a day.
High efficiency processing because of simultaneous finishing the work of 2 surfaces by double blades.

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3. Risk aversion treatment

To avoid any risk in the slicing process of wafer manufacturing, the end face of the quadrangular prism is grinded to 90 degrees.

Face grinding equipment

Grind the end face of a silicon block in high precision for solar use.
Revise the end squareness of a silicon ingot to an accurate angle through grinding, to avoid the wire from breaking in the slicing process which occurs due to inaccurate end squareness.

４. Treatment of wafer yield enhancement

To improve the yield of the wafer, the damaged layers of the R-surface and the flat plane are removed through grinding and polishing.

Multi-axis grinding and polishing equipment

With a multi-axis head, the device grinds and polishes the plane, the R-surface and C-surface.
By using a work-stocker, the machine runs 24 hours a day from injection, via cutting and polishing, to the ejection of the work.

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５. Wafer manufacturing

Slice with wire-saw and manufacture wafer.