Puropose of use

A single unit covers both the input & output of work pieces, and the grinding & polishing with high efficiency and great precision.

Product Features

1. Grinding device for squarely cut silicon ingot
2. 6 spindles and 3 axis of finishing levels on both sides realize high precision plane grinding in a single operation, therefore highly efficienct.
3. Grinding of an R-plane, C-plane, and a level surface is available without grindstone exchanges.
4. Loading, processing, work rotation, and sending of works are automated by using a work stocker, therefore unmanned low-cost operation is available.
5. Auto centering system measures the height of each work with a sensor, and performs centering by up & down movement of the work receiving block.
6. Processing management is available with the reading of each products’ code# through a barcode reader and the data of precision levels of finished products are also managed. This system contributes to productivity improvement.

Main Specifications