Company history：Corporate Profile

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Mar. 1948	Started business activity as a manufacturer of stone tools, such as chisels and hammers.
Jan. 1955	The first version of manual polishing equipment was developed, and thereafter we have forayed into stone machinery.
Jun. 1958	Developed the first automatic polishing machine and achieved sales of 145 units in total. 55 units were delivered to the plants in Okazaki.
Jun. 1969	Moved into the Okazaki stonemasonry district to streamline the business process.
Jun. 1975	Shifted to corporation from personal organization, and registered as “Hara Ironworks Inc”.
Mar. 1979	Started manufacturing sales of “Gantry automatic polishing machine: AP-3”. The sales were 250 units in two years.
Oct. 1981	Extended factory to meet the larger size of equipment.
Aug. 1984	Completion of the test plant construction.
Mar. 1985	“Automatic continuous polishing line: CA-10PL” was developed.
Apr. 1985	Started manufacturing sales of the “NC-Yakumono Processing Machine: ACH-10-inch”.
Jan. 1990	Started manufacturing sales of “Intermittent ceramic cutting machine: SCT-90”.
Nov. 1993	Changed company name to "Hara Machinery Inc."
Jan. 1994	Constructed a larger plant in Taki-machi in Okazaki-city.
Mar. 2002	The company started to produce various devices for silicon processing, including the “Silicon ingot cutting machine: HS-3”.
Oct. 2002	“ELV disassembly line: BLM-01” was developed jointly with Mie University and other companies.
Apr. 2003	“Stone plate manufacturing machine: PB- 3053” was developed .
Feb. 2004	Exported “Diamond hole drilling machine: B-2” to Mexico.
May 2004	Exported “Diamond-wire-saw-beads: ACC-3540” (including automatic loading & unloading equipment) to Poland.
Dec. 2004	Installed “Precision grinding equipment: COP-1010” to RIKEN Independent administrative institution.
Jan. 2005	“Concrete slab auto processing line: GSE-934/GCE-925/GDD-926” was developed. (automated by CAD or CAM)
Jul. 2005	Exported “2-flute auto cutting device for silicon ingot: SIC-2008” to the United States.
May 2006	Developed “3-axis polisher for silicon: CB-210”.
Jul. 2006	Developed “2-flute 2-axis movable cutter: SIC-3000” for monocrystalline silicon processing.
Apr. 2010	The company received Aichi prefecture’s special grants aimed at the promotion of manufacturing technology in Aichi prefecture, and developed the “Solar tracking device”.
Dec. 2010	Exported “SOURCE ROD GRINDER (SCM-0075)” to Korea.