HOME > Corporate Profile:Company history
Mar. 1948 | Started business activity as a manufacturer of stone tools, such as chisels and hammers. |
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Jan. 1955 | The first version of manual polishing equipment was developed, and thereafter we have forayed into stone machinery. |
Jun. 1958 | Developed the first automatic polishing machine and achieved sales of 145 units in total. 55 units were delivered to the plants in Okazaki. |
Jun. 1969 | Moved into the Okazaki stonemasonry district to streamline the business process. |
Jun. 1975 | Shifted to corporation from personal organization, and registered as “Hara Ironworks Inc”. |
Mar. 1979 | Started manufacturing sales of “Gantry automatic polishing machine: AP-3”. The sales were 250 units in two years. |
Oct. 1981 | Extended factory to meet the larger size of equipment. |
Aug. 1984 | Completion of the test plant construction. |
Mar. 1985 | “Automatic continuous polishing line: CA-10PL” was developed. |
Apr. 1985 | Started manufacturing sales of the “NC-Yakumono Processing Machine: ACH-10-inch”. |
Jan. 1990 | Started manufacturing sales of “Intermittent ceramic cutting machine: SCT-90”. |
Nov. 1993 | Changed company name to "Hara Machinery Inc." |
Jan. 1994 | Constructed a larger plant in Taki-machi in Okazaki-city. |
Mar. 2002 | The company started to produce various devices for silicon processing, including the “Silicon ingot cutting machine: HS-3”. |
Oct. 2002 | “ELV disassembly line: BLM-01” was developed jointly with Mie University and other companies. |
Apr. 2003 | “Stone plate manufacturing machine: PB- 3053” was developed . |
Feb. 2004 | Exported “Diamond hole drilling machine: B-2” to Mexico. |
May 2004 | Exported “Diamond-wire-saw-beads: ACC-3540” (including automatic loading & unloading equipment) to Poland. |
Dec. 2004 | Installed “Precision grinding equipment: COP-1010” to RIKEN Independent administrative institution. |
Jan. 2005 | “Concrete slab auto processing line: GSE-934/GCE-925/GDD-926” was developed. (automated by CAD or CAM) |
Jul. 2005 | Exported “2-flute auto cutting device for silicon ingot: SIC-2008” to the United States. |
May 2006 | Developed “3-axis polisher for silicon: CB-210”. |
Jul. 2006 | Developed “2-flute 2-axis movable cutter: SIC-3000” for monocrystalline silicon processing. |
Apr. 2010 | The company received Aichi prefecture’s special grants aimed at the promotion of manufacturing technology in Aichi prefecture, and developed the “Solar tracking device”. |
Dec. 2010 | Exported “SOURCE ROD GRINDER (SCM-0075)” to Korea. |