Puropose of use

Fast and high precision processing of polycrystalline silicon or pulled out monocrystalline silicon periphery.

Product Features

1. High efficiency cylinder periphery grinding of polycrystalline silicon or monocrystalline silicon pulled out of the melt.
2. Rough finishing is available at once because of a double grindstone.
3. Auto centering system measures diameter of each with a sensor, and practices centering by up & down movement of the work receiving block.
4. Both measurement of the amount of grindstone wear and correction of the cut are performed automatically.
5. By scanning the shape of the work, the device recognizes automatically where the first cutting point is.
6. Loading, processing, and sending of works are automated by using a work stocker, therefore unmanned low-cost operation is available.※Stocker is an option.

Main Specifications